BGA/LGA ATE TEST SOCKETS

BGA ATE Test Socket

BGA ATE X-Section

 

 

 

 

 

 

 

TECHNOLOGY FEATURE SET

A quantum leap in ATE Test Socket design - The RC Springprobe AT™ from Ardent Concepts has a shorter test height than traditional spring pins, higher AC performance and lower overall socket costs. Offered in a broad range of standard and custom designed ATE sockets for FPGAs, Processors, wireless LAN, Bluetooth Wireless, GPS and Satellite Radio IC's, RC Springprobe AT Technology is a reliable, discrete node, z-axis interconnect solution for RF testing of BGA and LGA Devices.

View Drawing Request Quote Brochure

SPECIFICATIONS

PRODUCTION PROVEN PERFORMANCE

Ardent's proprietary wire-form technology is designed for unparalleled AC performance coupled with consistent contact force throughout the life of the contact. With Ardent's all-metal technology, tight pitch area array requirements can be met without sacrificing signal integrity.

All-metal technology allows Ardent RC Springprobe™ products to offer unparalleled performance, speed, and consistency.

 

 

 

 



 

 

 
image