LGA/BGA/Area Array Sockets

Custom BGA Test Contactor System (.65mm Pitch)

High node-count area array RF sockets are a featured Ardent Product Suite. We build sockets with more than 2000 nodes and the shortest electrical path available in a discrete node contactor. Ardent Concepts has developed a BGA/LGA family of sockets which within a 2.5”X2.5” footprint, are able to accommodate up to 50mm X 50mm device. This superior electrical performance of RC Springprobe™ technology provides extremely good AC characteristics (up to 37GHz at <-1dB), consistent resistance (see brochure below) and low normal force (20-45 grams per node).

RF BGA/LGA Technology Feature Set

• Down to .4mm Pitch
• Family Socket Designs for Common Devices (see footprint)
• All-metal wire form (no pogo-pins, no elastomers)
• Less than 50 milliohms DC resistance
• Up to 37 GHz with less than -1db insertion loss in G-S-G configuration
• 100K minimum cycle life
• Replaceable contacts and elements
• Vacuum fixture for repopulating RC Springprobes supplied with order
• Easily maintainable socketing system
• Can easily accommodate other manufacturers footprints
• Micro-adjustable screw type manual actuator
• Up to 2000+ Positions


Ardent's proprietary wire-form technology is designed for unparalleled AC performance coupled with consistent contact force throughout the life of the contact. With Ardent's all-metal technology, tight pitch area array requirements can be met without sacrificing signal integrity.

Ardent Concepts designs and builds contractor technology for a range of pitches, package types, and interfaces. Our solutions are designed to meet the needs of customers beyond the limits of elastomers or pogo pins. We work closely with our customers to develop solutions for specific interconnect applications.

All-metal technology allows Ardent RC Springprobe™ products to offer unparalleled performance, speed, and consistency.

With RC Springprobe™ technology, Ardent Concepts has made a quantum leap in testing connectivity. The RC Springprobe™ architecture is designed to accommodate a variety of applications and package types. Ardent contactors are designed for high-performance over extended cycles for BGA/LGA and other package types.

Our unique contact-element system allows for a wide variety of tip geometries for ball/pin or pad contact requirements. Additionally, this design provides an additional measure of robustness without sacrificing signal integrity. The test height of this interposer design is shorter than .100'' (2.54mm) in 1 and 1.27mm pitch configurations.

 

 

 


 

 

 

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