HIGH PERFORMANCE BGA TEST SOCKETS

.5MM Pitch BGA Test Socket

BGA X-Section

 

 

 

 

 

 

 

TECHNOLOGY FEATURE SET

With RC Springprobe™ technology, custom footprints are easy for high performance chip socket requirements. Our durable, multi-GHz Socket solutions offer low loss connection for wireless devices, processors, FPGA and other high performance devices. If you have a tough BGA Socket requirement, contact us to see if RC Springprobe™ technology is right for your project.

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SPECIFICATIONS

PRODUCTION PROVEN PERFORMANCE

Ardent's proprietary wire-form technology is designed for unparalleled AC performance coupled with consistent contact force throughout the life of the contact. With Ardent's all-metal technology, tight pitch area array requirements can be met without sacrificing signal integrity.

All-metal technology allows Ardent RC Springprobe™ products to offer unparalleled performance, speed, and consistency.

 

 

 

 



 

 

 
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