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Density Board to Board Connectors
Custom High Density Board
Connector (1mm Pitch)
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High Density
Connector Technology Feature Set
With RC Springprobe™
technology, extremely high density requirements can be satisfied
without extreme force. Our contact requires only 20-30 grams
of force per node to maintain electrical connectivity. And
with contact heights as low as .032'', stack ups can be
reduced without sacrificing signal integrity. If you have
a tough high density interposer requirement, contact
us to see if RC Springprobe™ technology is right
for your project.
• Down to .4mm
Pitch
• Thousands of High Density Positions Possible
• Less than 50 milliohms DC resistance
• 2 AMP Current Carrying Capacity (Pitch Dependent)
• Up to 37 GHz with less than -1db insertion loss
in G-S-G configuration
• 100K minimum cycle life
• High force per unit area coupled with low overall
force due to fine-point contact
• Rated for Mil Spec Applications
Ardent's
proprietary high density wire-form technology is designed for unparalleled
AC performance coupled with consistent contact force throughout
the life of the contact. With Ardent's all-metal technology,
tight pitch area array requirements can be met without
sacrificing signal integrity.
Ardent Concepts designs and builds high density connector
technology for a range of pitches, package types, and
interfaces. Our solutions are designed to meet the needs
of customers beyond the limits of elastomers or spring
probes. We work closely with our customers to develop
solutions for specific interconnect applications.
All-metal technology allows Ardent RC Springprobe™
products to offer unparalleled performance, speed, and
consistency.
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