| TECHNOLOGY
FEATURE SET
With RC Springprobe™ technology,
extremely high node count requirements can be satisfied without
extreme force. Our system can be designed to work with LESS
THAN 5 GRAMS OF FORCE per node to maintain electrical connectivity.
And with contact heights as low as .032'', stack ups can be
reduced without sacrificing signal integrity. If you have
a tough Board to Board Connector requirement, contact us to
see if RC Springprobe™ technology is right for your
project.
SPECIFICATIONS
Down to .3mm Pitch
Thousands of Positions Possible
Less than 50 milliohms DC resistance
1-5 AMP Current Carrying Capacity
(Pitch Dependent)
Up to 37 GHz with less than -1db insertion
loss in G-S-G configuration
100K minimum cycle life
As Low as 5 Grams of Force Per Node
Rated for Mil Spec Applications
PRODUCTION PROVEN PERFORMANCE
Ardent's proprietary wire- form technology
is designed for unparalleled AC performance coupled with consistent
contact force throughout the life of the contact. With Ardent's
all-metal technology, tight pitch area array requirements
can be met without sacrificing signal integrity.
All-metal technology allows Ardent
RC Springprobe™ products to offer unparalleled performance,
speed, and consistency.
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