Ardent Concepts Contactors and Interconnect interfaces are based on our proprietary wire form contact, the RC Spring Probe™. This new technology is capable of the highest loop through bandwidth of any metal, area array contact element available and is capable of pitches down to .4mm. The RC Spring Probe™ is capable of contacting many package and board designs. Test socket designs for tight pitch area array and high-node count requirements are available, and we can help you to design and build your own using RC Spring Probe™ technology.

The RC Spring Probe™ is available in a variety of pitch and height configurations. We will work with you on your custom design applications, provide sample contacts, and help you to determine the best contact size and pitch for your particular compliant interconnect requirement. Use the table below to view more detailed information on the contacts, and gain an understanding of the anatomy of our interposer designs.

If you don't see what you are looking for in here, ask us for help. We have a number of custom contact designs based on the patented RC Spring Probe™ architecture. Our engineers will work within your requirements to determine the best possible solution for your test socket, compliant interposer or electrical connector needs.