© Copyright 2012 Ardent Concepts, Inc., 130 Ledge Road Unit 2 Seabrook, New Hampshire 03874 t: (603) 474-1760 f: (603) 474-1765 e: info@ardentconcepts.com

US Patent Numbers 6,787,709, 6,909,056, 7,126,062, 7,556,503. Other US & Foreign Patents Pending
          LGA Connector Specifications
.8MM Pitch LGA Connector
.8MM Pitch LGA Connector
LGA Connector Using RC Connect-R™ Technology
LGA Connector Using RC Connect-R™ Technology
LGA Connector Using RC Spring Probe™ Technology
LGA Connector Using RC Spring Probe™ Technology
LGA Connector Using RC Spring Probe™ + Elemenet
LGA Connector Using RC Spring Probe™ + Elemenet

RC™ technology makes custom high performance LGA Connectors and LGA Sockets possible with rapid lead times to meet your demanding interconnect schedule.

Our system is designed to be help customers go from prototype to high volume production with custom compression mount LGA solutions for applications such as:

Chip-to-Chip Interconnect
Board-to-Board Interconnect
High Performance Short Haul Interconnect
Pseudo-Coax High Performance Interposers
Low Force Space Transformers
High Speed Flex-to-Board Mezzanine Connectors
ASIC Interconnect fPGA Interconnect

Infinite custom height and pitch variations are possible with the scalable RC contact options. And with heights as low as .032'', stack ups can be reduced and exceptional signal integrity gains can be realized.

If you have a tough LGA Connector of Socket requirement, contact us to see if RC™ technology is right for your project.

 

View Drawing     Request a Quote      Brochure

SPECIFICATIONS

LGA Interposer Specs Table

 

PRODUCTION PROVEN PERFORMANCE


Ardent's proprietary wire-form technology is designed for unparalleled AC performance coupled with consistent contact force throughout the life of the contact. With Ardent's all-metal technology, tight pitch area array requirements can be met without sacrificing signal integrity.

All-metal technology allows Ardent RC Spring Probe™ products to offer unparalleled performance, speed, and consistency.