About Us

Ardent Concepts, Inc. leads the industry of high performance interconnect innovation with it's proprietary wire form compliant contact, the RC Springprobe™. This all metal contact technology offers electrical invisibility with a measured self inductance of .5nH exhibiting an insertion loss of -1db through 24GHz and a -3db through 30Ghz in .5mm pitch configuration. The contact achieves low contact resistance by using a low surface area contact patch which allows engineers to design high density connectors without high levels of contact force.

RC Springprobe™ technology can accommodate a wide variety of applications in area array and peripherally leaded connector designs. The contact can achieve pitches of .5mm on a variety of devices. The contact technology is ideal for RF testing of various package types including QFN packages, BGA/LGA large area array packages, PCB to PCB as well as all other chip scale, flip chip, substrate and all other packaged IC interconnections.

Mission Statement

We are an innovative design firm focused on developing the next generation of high speed technology for the compliant interconnect industry. Our product suite is designed to help our customers break through frequency barriers without increasing costs.

Vision

Ardent Concepts, Inc. is committed to advancing the interconnect industry to new levels of achievement. We strive to provide the highest levels of electrical interconnect invisibility, using experts with many years of experience in the field to design and build all of our contactors and interfaces. We are ardently committed to our craft, and pursue business with the highest degrees of technical acumen, ethics and environmental responsibility.