BOARD TO BOARD CONNECTORS

1.5MM Pitch Board to Board Connector

Board to Board System x-Section

TECHNOLOGY FEATURE SET

With RC Springprobe™ technology, extremely high node count requirements can be satisfied without extreme force. Our system can be designed to work with LESS THAN 5 GRAMS OF FORCE per node to maintain electrical connectivity. And with contact heights as low as .032'', stack ups can be reduced without sacrificing signal integrity. If you have a tough Board to Board Connector requirement, contact us to see if RC Springprobe™ technology is right for your project.

SPECIFICATIONS

Spring Probe

PRODUCTION PROVEN PERFORMANCE

Ardent's proprietary wire- form technology is designed for unparalleled AC performance coupled with consistent contact force throughout the life of the contact. With Ardent's all-metal technology, tight pitch area array requirements can be met without sacrificing signal integrity.

All-metal technology allows Ardent RC Springprobe™ products to offer unparalleled performance, speed, and consistency.