Chip to Board Connectors
Chip to Board Connectors – Options to Meet Your Needs
Patented chip to board interposer systems from Ardent Concepts are infinitely scalable in height, pitch and force. Ardent’s technology offers you multiple options for chip to board connectivity including the following:
LGA Connectors and LGA Sockets
Ardent’s spring loaded connectors provide super high AC performance, and are more cost effective than traditional pogo pin connector solutions. With SP™ technology, LGA sockets, interposers and LGA connectors can be designed cost effectively and quickly. We can design custom interposers for your application in DAYS, with prototypes available in many cases in just 2 WEEKS.
Custom LGA connectors are possible with rapid lead times to meet your demanding interconnect schedule. Our system is designed to meet the needs of customers from 10 to 10,000 units, with infinite custom height and pitch variations possible. And with contact heights as low as .030”, stack ups can be reduced without sacrificing signal integrity. If you have a tough interposer requirement, contact us to see how our proven technology can work for your project.
Universal BGA/LGA Connector available up to 50×50
While we pride ourselves on our fast turnaround for custom connectors, we also offer engineers existing commercial connectors to meet your immediate needs. All products are immediately available. Our durable multi-GHz BGA and LGA socket solutions offer low loss connection for wireless devices, processors, FPGA and other high performance devices.
The scalability of SP™ LGA connector technology is enabling next generation solutions that incorporate solder-less high speed optical Electrical Module replace-ability at 25 Gbps+ speeds. Ardent short haul interconnect solutions are specifically designed for chip to board applications where signal integrity and board density issues are paramount. Ardent high performance short haul interconnect solutions provide high speed input data rates in cost effective and real-estate friendly form factors for the ‘last millimeter’ of electrical interconnect.
Many of our customers are building large scale systems and need to plan for future optical module upgradability and/or replacement. In the past, most data transmission modules were soldered down in manufacturing and required expensive rework to introduce new designs or replace faulty modules.
Ardent’s super high speed, low profile short haul compression mount connectors enable these customers to plan for the future, perform module upgrades in the field, and completely eliminate solder re-work. Ardent LGA connectors have been extensively tested at 25 Gbps transmission speeds, and provide the critically low loss interface between backplane systems and the optical transceivers which are capable of pushing those signals out to 100 Gbps at the fiber.