i. At Ardent Concepts, we
design and manufacture the most innovative compression mount
interconnect solutions on the planet. Our customers rely
on us for our expertise, product performance and engineering
know-how.
ii. Below is a list of frequently asked questions. If you have a question not addressed below, please email us or call us.
ii. Below is a list of frequently asked questions. If you have a question not addressed below, please email us or call us.
What does Ardent Concepts do? What
is the RC Spring Probe™ Connector made of? What
is the contact design? What
are the insulators made of? What
is the number of points you are capable of? What
is the contact interface geometry? Why
is the RC Spring Probe™ Connector better than conductive
rubber? Why
is RC Spring Probe™ Connector better than pogo pins? What
install base do you have so far? What
is the resistance and cycle life for the RC Spring Probe™?
What
is the plating of the RC Spring Probe™?
What
is the current carrying capacity of the RC Spring Probe™?
A: Our firm is an customer spring loaded connector company. We have proprietary contact technology and supply compliant interconnect interfaces to the semiconductor manufacturing industry and the connector market at large. Our products offer some very compelling electrical characteristics that are extremely well suited for IC characterization and testing. We also build custom interfaces for a range of interconnect requirements.
A: This all metal, discrete node compression mount contact is made from a number of different materials and platings based on the particular applications. Some examples of materials used include Beryllium Copper, Paliney and Stainless Steel.
A: The RC Spring Probe™ design is a suite of proprietary wire forms. The concept is of an offset torsion spring coil that does not act like a coil inductor. In fact, as the coils rub on each other, they short electrically, resulting in an extremely short signal path. Our contact design is highly scalable, with varying pitch, travel, force and free length.
A: Various forms of thermally stable plastic, including Torlon, Vespel and Ultem.
A: We can design and build high node count interposer systems for many applications. Due to the low force required of our system, extremely high node count connectors and sockets are possible.
A:
A trimmed wire end .002"-.003" in diameter
on the board side. A variety of tip interfaces are possible
on the dynamic side, from four point crowns to reduced crowns
to bullet spears.
A: Less force, no memory, high cycle life, discrete contacts. In many cases, better electrical properties.
A: Better electrical properties, more readily scalable, tighter pitch capability, and lower cost.
A: Ardent products are used worldwide by some of the largest semiconductor producers. Our products are also used in a large number of RF Area Array applications, military spec applications, and high volume interposer systems.
A: Please see an example of one force deflection resistance (FvDvR) Curve here
A: In most cases, hard gold over nickel is the primary plating. We also have specialty plating available for specific applications, and semi-precious versions which do not require plating.
A: 1 to 5 AMPs, depending on pitch.