F.A.Q.
What does Ardent Concepts do?
What
is the RC Springprobe™ made of?
What
is the contact design?
What
are the insulators made of?
What
is the number of points you are capable of?
What
is the contact interface geometry?
Why
is the RC Springprobe™ better than conductive rubber?
Why
is RC Springprobe™ better than pogo pins?
What
install base do you have so far?
What
is the relationship between resistance and cycle life for
the RC Springprobe™?
What
is the plating of the RC Springprobe™?
What
is the current carrying capacity of the RC Springprobe™?
A: Our
firm is an Innovative Interconnect company. We have proprietary
contact technology and supply compliant interconnect interfaces
to the semiconductor manufacturing industry and the connector
market at large. Our products offer some very compelling electrical
characteristics that are extremely well suited for IC characterization
and testing. We also build custom interfaces for a range of
interconnect requirements.
A:
This all metal, discrete node compression mount contact is
made from a number of different materials and platings based
on the particular applications. Some examples of materials
used include Beryllium Copper, Paliney and Stainless Steel.
A:
The RC Spring Probe™ design is a proprietary wire form.
The concept is of an offset torsion spring coil that does
not act like a coil inductor. In fact, as the coils rub on
each other, they short electrically, resulting in an extremely
short signal path. Our contact design is highly scalable,
with varying pitch, travel, force and free length.
A:
Various forms of thermally stable plastic,
including Torlon, Vespel and Ultem.
| Q:
What is the number of points you are capable of? |
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A:
We can design and build high node count interposer systems
for many applications. Due to the low force required of our
system, extremely high node count connectors and sockets are
possible.
A:
A trimmed wire end .002"-.003" in diameter
| Q:
Why is the RC Spring Probe™ better than conductive
rubber? |
back to top |
A:
Less force, no memory, high cycle life, discrete contacts.
In many cases, better electrical properties.
| Q:
Why is the RC Spring Probe™ better than pogo pins? |
back to top |
A:
Better electrical properties, more readily scalable, tighter
pitch capability
A: We
have sites in production for RF BGA and LGA test, strip test
interface, board to board interface, and high performance
QFN. Our product is also used in a number of RF Area Array
applications, military spec applications, and high volume
interposer systems.
| Q:
What is the relationship between resistance and cycle
life for the Redundant Contact™? |
back to top |
A:
Please see our most current FvDvR Curve
here
| Q:
What is the plating of the Redundant Contact™? |
back to top |
A:
Gold over nickel. We also have specialty plating available
for specific applications.
| Q:
What is the current carrying
capacity of the Redundant Contact™? |
back to top |
A: 1
to 2.5 AMPs, depending on pitch.
|
