Proven Interconnect Performance
Meeting Industry Demands
Our clients are engineers testing and designing applications across
many industries. When it comes to interconnect solutions, there are
three common concerns engineering teams want to manage:
• Costs – managing
total costs and specifically interconnect costs as part of the
overall solution is a primary concern.
• Performance –
whether for production or in test environments, performance of the
interconnect solution whether
a test socket or a board to board connector, is an
obvious requirement.
• Footprint – increasingly,
managing the footprint is becoming a consistent
concern in designing smaller,
high performing solutions.
Ardent’s patented technologies enable high performing test sockets,
and a wide variety of connectors including board to board connectors,
flex to board connectors, mezzanine connectors and space transformers
as well as chip to chip connectors and chip to board connectors. For
testing or production, Ardent’s technologies scale to meet your
demands with unrivaled electrical performance.
We have proven applications in industries where durability and ruggedization
are critical requirements including in the communications industry and
defense and security sectors where exposure to harsh climates and impact
tolerances are strict. For other highly specialized fields such as medical
devices, we enable BOTH high performance and flexible designs specs.
Our technologies have been extensively tested for extended cycles and
at high speeds to ensure signal integrity and consistent performance
are achieved.
Ardent’s proven solutions and patented technologies are used by
leading global companies for applications in the defense
and security, medical device,
communications, computing
and semiconductor sectors.
