Topside Ring Connector
Chip to Chip Connectors for Long Cycles and Higher Signal Integrity
Ardent’s patented technologies enable chip to chip connectors to support your varied needs. From small volumes to demands for long cycle life, we offer a high quality molded solution or a machined option. Whatever your requirements for chip to chip connectivity, Ardent has the proven technology and the ability to meet your short lead times and performance requirements.
An interposer or LGA connector using the RC Connect-R™ technology enables a lower cost and is designed for high volume LGA connector applications where signal integrity is paramount and temperature and environmental conditions are challenging. This stamped, formed compression mount contact technology offers tighter pitch, higher signal integrity and a longer cycle life ideal for systems integrators and IC manufacturers.
A higher density alternative is our custom chip to chip connector or interposer using
RC Spring Probe™ technology. This custom LGA interposer is specifically designed for OEMs for production volumes with primary benefits over the competition include a smaller footprint, faster and exceptional signal integrity.
Custom LGA connectors are possible with rapid lead times to meet your demanding interconnect schedule. Our system is designed to meet the needs of customers from 10 to 10,000 units, with infinite custom height and pitch variations possible. And with contact heights as low as .030'', stack ups can be reduced without sacrificing signal integrity. If you have a tough interposer requirement,
contact us to see how our proven technology can work for your project.
Chip to Chip Connector Case Study – Topside Interconnect
Read about an industry leader and their view of Ardent’s high performing LGA Connectors.
LGA Connector Specifications
Next Generation LGA Connectors – Optical
The scalability of RC Spring Probe LGA connector technology is enabling next generation solutions that incorporate solder-less high speed optical Electrical Module replace-ability at 25 Gbps+ speeds. Ardent short haul interconnect solutions are specifically designed for chip to chip applications where signal integrity and board density issues are paramount. Ardent high performance short haul interconnect solutions provide high speed input data rates in cost effective and real-estate friendly form factors for the 'last millimeter’ of electrical interconnect.
Many of our customers are building large scale systems and need to plan for future optical module upgradability and/or replacement. In the past, most data transmission modules were soldered down in manufacturing and required expensive rework to introduce new designs or replace faulty modules.
Ardent's super high speed, low profile short haul compression mount connectors enable these customers to plan for the future, perform module upgrades in the field, and completely eliminate solder re-work. Ardent LGA connectors have been extensively tested at 25 Gbps transmission speeds, and provide the critically low loss interface between backplane systems and the optical transceivers which are capable of pushing those signals out to 100 Gbps at the fiber.
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