High Speed Multicoax Assemblies
High-density, low loss access to multiple high frequency channels. Deployed across high-speed electronics markets including Semiconductor, Communications, Consumer, Supercomputing, and Defense.
- Excellent signal integrity out to 70 GHz
- Long term electrical repeatability of connector performance
- Compression-mount: no solder-down components
- Small PCB Footprint
50 ohm access to IC contact pads and signal paths on an IC circuit footprint, this solution is a simple to manipulate, cost effective and time saving alternative to expensive X-Y tables and fragile planar probes for Engineers who may need to probe multiple signals at once.
- Reference Design De-Bug
- Reference Design Loss De-Embedding
- Test Interface Characterization
- Test Interface Troubleshooting
- Probe Card Verification
High-density, high speed connectors with superior signal integrity. Range of form factors and rugged capabilities for Computing, Medical, Defense, Communications and Consumer applications. Ardent’s compression mount connectors can drop in and replace expensive pogo pins or unreliable elastomeric contact sets.
- 1mm Universal
- Board to Board
- Chip to Chip
High performing, compression-mount socket solutions for BGA and LGA, QFN/QFP, MEMS and test contactors for other small form factor devices. Don’t see the socket you need? Let us design a custom socket to fit your requirements.
- Accommodate Wide Range of Package Sizes
- Custom Designs Available