RF QFN Test Sockets

RF QFN/MLF Technology Feature Set

• Down to .4mm pitch
• Recessed pads and edges OK
• Up to 24 GHz at <-1dB
• Hand Test and ATE
• 100K minimum cycle life
• Easy replacement contact kit

With RC Spring Probe™ technology, Ardent Concepts has made a quantum leap in testing connectivity. The RC Spring Probe™ architecture is designed to accommodate a variety of applications and package types. Ardent contactors are designed for high-performance over extended cycles for QFN/MLF/DFN and other package types.

Our unique contact-element system allows for a wide variety of tip geometries for ball/pin or pad contact requirements. Additionally, this design provides an additional measure of robustness without sacrificing signal integrity. The test height of this interposer design is shorter than .32'' (.8mm) in .5mm pitch configurations.

Ardent's proprietary wire-form technology is designed for unparalleled AC performance coupled with consistent contact force throughout the life of the contact. With Ardent's all-metal technology, tight pitch area array requirements can be met without sacrificing signal integrity.

Ardent Concepts designs and builds contractor technology for a range of pitches, package types, and interfaces. Our solutions are designed to meet the needs of customers beyond the limits of elastomers or spring probes. We work closely with our customers to develop solutions for specific interconnect applications.

All-metal technology allows Ardent RC Spring Probe™ products to offer unparalleled performance, speed, and consistency.