How We Solve Your Interconnect Challenges
At Ardent Concepts we design and manufacture the most innovative high speed connector solutions on the planet. Our patented products are designed to change the way engineers think about high speed interconnect and meet the performance demands of signal integrity experts.
We live and breath high speed connectors, and focus on helping
bring next generation computing to market through novel connector
designs for test & measurement, OEM applications, and specialized
military applications. Ardent's patented contact technologies are
well suited for advanced multi-GHz applications such as board stack
connectors, coaxial connectors, fPGA sockets, flex circuit connectors,
probe interfaces, and mezzanine card connectors. We have a complete
line of high performance test socket solutions for the most advanced
chipsets such as RF devices, ASICS, switches, processors and MEMS
Ardent's revolutionary patented connector technology portfolio ensures accurate designs and quick turnaround for custom or off the shelf high speed connector solutions for test environments and OEM production applications. We support chip to chip, chip to board, board to board and flex to board applications.
Signal Integrity. Ardent
is passionate about high performance. We are dedicated to improving
the data rates of even the most advanced test programs & systems.
We care about bandwidth, and have the data to back it up.
Performance. Proven applications
across many industries including tested
and qualified for mil-spec applications.
Cost. Faster time to
market reduces overall cost; innovative and flexible interconnect
designs promote manufacturing efficiencies and higher performance
converts to lower overall cost of ownership.