High volume capabilities delivering high speed custom connectors with lower costs and quick turnaround. chip to chip, chip to board, board to board, flex to board and space transformers…
Best price and fast turnaround in a BGA socket, LGA test socket, QFN/QFP test socket and non standard test sockets.
Connectors immediately available to meet your needs. BGA, LGA and PGA connectors and fPGA packages and more to come…
Innovation & Ingenuity
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How We Solve Your Interconnect
Challenges
At Ardent Concepts we design and manufacture the most innovative compression
mount interconnect solutions on the planet. As engineers, we speak your
language – tighter pitch, better signal integrity, smaller footprints…all
at a lower total cost.
Our revolutionary patented technology offers you quick turnaround for custom
or off the shelf interconnect solutions in both test environments and for
OEM production. We support chip to chip,
chip to board, board to board
and flex to board applications.
There are many reasons to work with Ardent Solutions for interconnect solutions.
Below are the top 3 reasons our clients count on Ardent:
1. Innovation - We get you to market quicker with our innovative
interconnect solutions.
2. Performance - Proven applications across many industries
including tested and qualified for
mil-spec applications.
3. Cost - Faster time to market reduces overall cost; innovative
and flexible interconnect designs promote manufacturing efficiencies and
higher performance converts to lower TCO.
"Ardent makes the fastest compression mount interconnect solution on the planet. We see the fastest edge rates in our system when using your connector compared to everything else we have tried."
- R&D Manager, World's Largest Semiconductor Company


