© Copyright 2014 Ardent Concepts 130 Ledge Road, Seabrook, New Hampshire 03874 USA t: (603) 474-1760 f: (603) 474-1765 e: info@ardentconcepts.com

US Patent Numbers 6,787,709, 6,909,056, 7,126,062, 7,556,503. Other US & Foreign Patents Pending.


How We Solve Your Interconnect Challenges

At Ardent Concepts we design and manufacture the most innovative high speed connector solutions on the planet. Our patented products are designed to change the way engineers think about high speed interconnect and meet the performance demands of signal integrity experts.


We live and breath high speed connectors, and focus on helping bring next generation computing to market through novel connector designs for test & measurement, OEM applications, and specialized military applications. Ardent's patented contact technologies are well suited for advanced multi-GHz applications such as board stack connectors, coaxial connectors, fPGA sockets, flex circuit connectors, probe interfaces, and mezzanine card connectors. We have a complete line of high performance test socket solutions for the most advanced chipsets such as RF devices, ASICS, switches, processors and MEMS devices.

Ardent's revolutionary patented connector technology portfolio ensures accurate designs and quick turnaround for custom or off the shelf high speed connector solutions for test environments and OEM production applications. We support chip to chip, chip to board, board to board and flex to board applications.


Why Ardent?

Signal Integrity. Ardent is passionate about high performance. We are dedicated to improving the data rates of even the most advanced test programs & systems. We care about bandwidth, and have the data to back it up.

Performance. Proven applications across many industries including tested and qualified for mil-spec applications.

Cost. Faster time to market reduces overall cost; innovative and flexible interconnect designs promote manufacturing efficiencies and higher performance converts to lower overall cost of ownership.

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