Board to Board Connectors – RF Interposers
High Speed and Tight Densities
For many high speed microwave RF applications, designing a perfect impedance matched connector using traditional technologies can be difficult. Here at Ardent, we have modeled various electrical environments of our RF connector. These models are capable of creating controlled impedance from 50 Ohms to 100 Ohms +/-2.5 Ohms down to very tight densities. Ultra thin RF interposers (.9mm) from Ardent can transmit signals up to 40 Gbps at less than -30db cross talk for exceptional signal speeds through the system.
With all metal SP™ technology, design engineers can implement the shortest, fastest, compression mount connector technology on the planet for capital equipment designs, radar system, RF communication systems, Antenna and a host of other RF applications. SP™ technology has the capability to withstand high shock and vibration applications as well as applications requiring extreme temperatures from -50C to 150C.
Ardent can provide extremely precise volume RF interposers, mezzanine connectors, and system board interfaces which offer some of the cleanest AC performance in the industry. Our world class design team will work with you to match the specific RF connector concept to your application.