US Patent Numbers 6,787,709, 6,909,056, 7,126,062,
7,556,503. Other US & Foreign Patents Pending
RF Connectors & Interposers
50 Ohm RF Interposer
Space Transformer Interposer
Board to board connectors, chip
to board and chip to chip connectors – scalable with small footprints
Ardent’s precision engineering and rapid prototyping
capabilities help engineers reduce lead times, reduce footprints and
reduce costs. With our patented technology, we can deliver super high
speed spring loaded connectors for prototypes while scaling to meet
high volume production demands. Our technology is designed to provide
high flexibility in design which converts to cost effective interposers
We can design custom connectors for your application in just DAYS and
prototypes are available in many cases in 2 WEEKS or less.
Scalable – using our patented technology, RC
Spring Probe™, Ardent’s custom connector systems are
infinitely scalable in height, pitch and force. Our spring loaded connectors
provide super high AC performance and are more cost effective than traditional
pogo pin connector solutions. Custom LGA connectors can be designed
from an existing ‘family’ of footprints or matched to your
current board layout.
Small Footprint – Ardent’s spring loaded
connector systems are compression mount with SMALL footprints to minimize
keep-out areas. Low force and high node count applications can be satisfied
with excellent signal integrity and consistent DC resistance.
Learn more about Ardent’s chip to chip connectors, chip to board
connectors and board to board connectors including flex
to board connectors and space transformers.