GHz BGA Sockets & LGA Interposers

High Volume Universal BGA Sockets and LGA Interposers

Molded 1mm Pitch BGA Sockets using Connect-R™ technology are available off the shelf to meet your immediate needs. These durable multi-GHz BGA socket solutions offer low loss compression mount connection for processors, FPGAs, ASIC, MMICS and other high performance devices. Ardent BGA Sockets can be modified for any package size up to 50mm x 50mm with short lead times. RC Connect-R BGA Sockets & LGA Interposers are perfect for RF applications with temperature excursions and can stand up to the most demanding environmental factors. Hardware options are available for a variety of temperature control and mounting configurations.

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Custom BGA Sockets & LGA Interposers (.3mm Pitch and Up)

Patented SP™ socket technology from Ardent Concepts is infinitely scalable in height, pitch and force.

Ardent’s spring loaded sockets provide super high AC performance, and are more cost effective than traditional pogo pin BGA socket solutions. With SP™ technology BGA sockets, LGA interposers and BGA test sockets can be designed cost effectively and quickly. We can design custom BGA sockets &LGA Interposers for your application in DAYS, with prototypes available in many cases in just 2-3 WEEKS.

BGA Sockets and LGA Interposers are possible with rapid lead times to meet your demanding interconnect schedule. Our system is designed to meet the needs of customers from 10 to 10,000 units, with infinite custom height and pitch variations possible. And with contact heights as low as .030”, stack ups can be reduced without sacrificing signal integrity. If you have a tough interposer requirement, contact us to see how our proven technology can work for your project.

The scalability of SP™ socket technology is enabling a number of next generation solutions – such as incorporating solderless high speed Optical Electrical Modules at 25 Gbps+ speeds. Ardent short haul interconnect solutions are specifically designed for chip to board applications where signal integrity and board density issues are paramount.

Many of our customers are building large scale systems and need to plan for future module upgradability and/or replacement. In the past, most data transmission modules were soldered down in manufacturing and required expensive rework to introduce new designs or replace faulty modules. Ardent’s super high speed, low profile short haul compression mount connectors enable these customers to plan for the future, perform module upgrades in the field, and completely eliminate solder re-work. Ardent sockets have been extensively tested at 25 Gbps transmission speeds, and provide the critically low loss interface between backplane systems and the optical transceivers which are capable of pushing those signals out to 100 Gbps at the fiber.

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