TECHNOLOGY FEATURE SET
With RC Spring Probe™ technology, custom footprints
are easy for high performance chip for LGA or BGA socket requirements.
Our durable, multi-GHz BGA Socket solutions offer low loss connection
for wireless devices, processors, FPGA and other high performance devices.
If you have a tough BGA/ Socket requirement, contact us to see if RC
Spring Probe™ technology is right for your project.
PRODUCTION PROVEN PERFORMANCE
Ardent's proprietary wire-form technology is designed for unparalleled AC performance coupled with consistent contact force throughout the life of the contact. With Ardent's all-metal technology, tight pitch area array requirements can be met without sacrificing signal integrity.
All-metal technology allows Ardent
RC Spring Probe™ products to offer unparalleled performance, speed, and consistency.
BGA Socket
BGA Socket X-Section
TECHNOLOGY FEATURE SET
With RC Spring Probe™ technology, custom footprints
are easy for high performance chip for LGA or BGA socket requirements.
Our durable, multi-GHz BGA Socket solutions offer low loss connection
for wireless devices, processors, FPGA and other high performance devices.
If you have a tough BGA/ Socket requirement, contact us to see if RC
Spring Probe™ technology is right for your project.
PRODUCTION PROVEN PERFORMANCE
Ardent's proprietary wire-form technology is designed for unparalleled AC performance coupled with consistent contact force throughout the life of the contact. With Ardent's all-metal technology, tight pitch area array requirements can be met without sacrificing signal integrity.
All-metal technology allows Ardent
RC Spring Probe™ products to offer unparalleled performance, speed, and consistency.
BGA Socket
BGA Socket X-Section