TECHNOLOGY FEATURE SET
With
RC Spring Probe™ technology, custom footprints are easy for high performance chip socket requirements. Our durable, multi-GHz BGA/LGA Socket solutions offer low loss connection for wireless devices, processors, FPGA and other high performance devices. If you have a tough BGA/LGA Socket requirement, contact us to see if
RC Spring Probe™ technology is right for your project.
TEST SOCKET
SPECIFICATIONS
PRODUCTION PROVEN PERFORMANCE
Ardent's proprietary wire-form technology is designed for unparalleled AC performance coupled with consistent contact force throughout the life of the contact. With Ardent's all-metal technology, tight pitch area array requirements can be met without sacrificing signal integrity.
All-metal technology allows Ardent
RC Spring Probe™ products to offer unparalleled performance, speed, and consistency.
.5MM Pitch BGA/LGA Test Socket
BGA/LGA X-Section
TECHNOLOGY FEATURE SET
With
RC Spring Probe™ technology, custom footprints are easy for high performance chip socket requirements. Our durable, multi-GHz BGA/LGA Socket solutions offer low loss connection for wireless devices, processors, FPGA and other high performance devices. If you have a tough BGA/LGA Socket requirement, contact us to see if
RC Spring Probe™ technology is right for your project.
TEST SOCKET
SPECIFICATIONS
PRODUCTION PROVEN PERFORMANCE
Ardent's proprietary wire-form technology is designed for unparalleled AC performance coupled with consistent contact force throughout the life of the contact. With Ardent's all-metal technology, tight pitch area array requirements can be met without sacrificing signal integrity.
All-metal technology allows Ardent
RC Spring Probe™ products to offer unparalleled performance, speed, and consistency.
.5MM Pitch BGA/LGA Test Socket
BGA/LGA X-Section