Events in June 2023

1:01 pm: Alleviating Loss Budget Challenges in 112/224G Development with Substrate Launch Development Kits Using TR Multicoax™ Connectors

1:00 pm: Exploring TR90™: New Form Factors for 112G / 224G Development and Beyond

1:00 pm: TR Multicoax™ Navigating the Shift to Ku / K / Ka Band Signaling in Space and Defense Applications

1:01 pm: Alleviating Loss Budget Challenges in 112/224G Development with Substrate Launch Development Kits Using TR Multicoax™ Connectors

1:00 pm: Exploring TR90™: New Form Factors for 112G / 224G Development and Beyond

1:00 pm: TR Multicoax™ Navigating the Shift to Ku / K / Ka Band Signaling in Space and Defense Applications

1:01 pm: Alleviating Loss Budget Challenges in 112/224G Development with Substrate Launch Development Kits Using TR Multicoax™ Connectors

1:00 pm: Exploring TR90™: New Form Factors for 112G / 224G Development and Beyond

1:00 pm: TR Multicoax™ Navigating the Shift to Ku / K / Ka Band Signaling in Space and Defense Applications

1:01 pm – 1:30 pm
June 8, 2023

Ardent’s TR Multicoax™ Series SLTF (Substrate Launch Test Fixture) uses the solderless compression mount, high-frequency approach of our TR Multicoax family connectors to terminate directly to the top of substrates or similar packages. Alongside our versatile SK Series™ sockets, SLTF allows developers to launch all high-frequency lanes through coax while routing less critical lower speed and power traces through the PCB, all accomplished solderlessly.

Key takeaways:
• Compression interface requires no solder-down components on fragile substrates/silicon
• TR Multicoax design is integrated with the Ardent SK high speed socket & lid for an all-in-one solution.
• Minimize mounting and tooling points in PCB to make signal routing simpler for complex boards/devices.

Register Here

1:00 pm – 1:30 pm
June 15, 2023

The TR90 Multicoax connector is a compression mount, multi-port cable assembly for carrying high speed analog or digital signals. With true 90 GHz performance targeting the design and development of 112G and 224G PAM4 based technologies and a compression mount interface which drives lower total cost of testing by avoiding costly solder-down components that can’t be recovered, and encouraging reuse across programs, TR is ideal for designers of cutting-edge systems.

Designers and manufacturers of optical module, transmission line, switch/routing ASIC, SerDes IP, switch/routing box, datacenter chassis, and AI accelerator products can leverage TR90’s newly designed interface and printed circuit board footprint to achieve exceptional signal integrity.

Key Takeaways:
• Ardent's TR90 connector boasts exceptional signal integrity out to 90 GHz
• Solderless, compression mount technology offers exponential time and cost savings
• Multiple form factors are offered to suit your specific application needs

Register Here

1:00 pm – 1:30 pm
June 20, 2023

Join us for an insightful webinar as we delve into the dynamic world of space and defense radio frequencies. As data throughputs and commercial demands continue to soar, the need for increased bandwidth has led to a shift towards Ku/K/Ka band signaling, operating within the 12-40 GHz range.
However, this transition provides a set of challenges that we will explore in depth. One critical aspect is the shielding of RF Tx/Rx signals, which is crucial to ensure signal integrity and prevent interference. We will also examine the potential risks to the reliability and longevity of solder joints in traditional surface-mount technology (SMT) connectors and how the extreme conditions experienced during launch and thermal cycling put these solder joints at risk, highlighting the importance of robust design and engineering practices.
Amphenol Ardent Concepts’ TR Multicoax™ Series is an ideal solution to these and other challenges. Available in a variety of frequencies and form factors, our solderless, compression mount test connectors are designed to provide excellent and consistent results in the harshest environments while mitigating the risk of mechanical failure throughout launch and thermal cycling.
Key Takeaways:
• The shift toward Ku/K/Ka band signaling (12-40 GHz) presents challenges beyond the capabilities of traditional, commercial connectors
• Reliability/longevity of solder joints for traditional SMT connectors are at-risk through launch and thermal cycling
• Ardent's TR Multicoax™ Series high-density connectors are designed to provide reliable results in the harshest environments

Register Here

8 1:01 pm: Alleviating Loss Budget Challenges in 112/224G Development with Substrate Launch Development Kits Using TR Multicoax™ Connectors 1:01 pm: Alleviating Loss Budget Challenges in 112/224G Development with Substrate Launch Development Kits Using TR Multicoax™ Connectors 1:01 pm – 1:30 pm June 8, 2023 Ardent’s TR Multicoax™ Series SLTF (Substrate Launch Test Fixture) uses the solderless compression mount, high-frequency approach of our TR Multicoax family connectors to terminate directly to the top of substrates or similar packages. Alongside our versatile SK Series™ sockets, SLTF allows developers to launch all high-frequency lanes through coax while routing less critical lower speed and power traces through the PCB, all accomplished solderlessly. Key takeaways: • Compression interface requires no solder-down components on fragile substrates/silicon • TR Multicoax design is integrated with the Ardent SK high speed socket & lid for an all-in-one solution. • Minimize mounting and tooling points in PCB to make signal routing simpler for complex boards/devices. Register Here

15 1:00 pm: Exploring TR90™: New Form Factors for 112G / 224G Development and Beyond 1:00 pm: Exploring TR90™: New Form Factors for 112G / 224G Development and Beyond 1:00 pm – 1:30 pm June 15, 2023 The TR90 Multicoax connector is a compression mount, multi-port cable assembly for carrying high speed analog or digital signals. With true 90 GHz performance targeting the design and development of 112G and 224G PAM4 based technologies and a compression mount interface which drives lower total cost of testing by avoiding costly solder-down components that can’t be recovered, and encouraging reuse across programs, TR is ideal for designers of cutting-edge systems. Designers and manufacturers of optical module, transmission line, switch/routing ASIC, SerDes IP, switch/routing box, datacenter chassis, and AI accelerator products can leverage TR90’s newly designed interface and printed circuit board footprint to achieve exceptional signal integrity. Key Takeaways: • Ardent's TR90 connector boasts exceptional signal integrity out to 90 GHz • Solderless, compression mount technology offers exponential time and cost savings • Multiple form factors are offered to suit your specific application needs Register Here

20 1:00 pm: TR Multicoax™ Navigating the Shift to Ku / K / Ka Band Signaling in Space and Defense Applications 1:00 pm: TR Multicoax™ Navigating the Shift to Ku / K / Ka Band Signaling in Space and Defense Applications 1:00 pm – 1:30 pm June 20, 2023 Join us for an insightful webinar as we delve into the dynamic world of space and defense radio frequencies. As data throughputs and commercial demands continue to soar, the need for increased bandwidth has led to a shift towards Ku/K/Ka band signaling, operating within the 12-40 GHz range. However, this transition provides a set of challenges that we will explore in depth. One critical aspect is the shielding of RF Tx/Rx signals, which is crucial to ensure signal integrity and prevent interference. We will also examine the potential risks to the reliability and longevity of solder joints in traditional surface-mount technology (SMT) connectors and how the extreme conditions experienced during launch and thermal cycling put these solder joints at risk, highlighting the importance of robust design and engineering practices. Amphenol Ardent Concepts’ TR Multicoax™ Series is an ideal solution to these and other challenges. Available in a variety of frequencies and form factors, our solderless, compression mount test connectors are designed to provide excellent and consistent results in the harshest environments while mitigating the risk of mechanical failure throughout launch and thermal cycling. Key Takeaways: • The shift toward Ku/K/Ka band signaling (12-40 GHz) presents challenges beyond the capabilities of traditional, commercial connectors • Reliability/longevity of solder joints for traditional SMT connectors are at-risk through launch and thermal cycling • Ardent's TR Multicoax™ Series high-density connectors are designed to provide reliable results in the harshest environments Register Here