High density RF and high speed TR Multicoax™ Series
A major IC manufacturer was developing server processors and needed a way to test high-speed IO signals for data rate and accuracy.
A major IC Manufacturer was developing a next generation chipset with multiple lanes of high speed SerDes for a highly integrated, scalable metro transport solution with reduced power, cost and
complexity.
A major consumer product company was developing sub-system that required 40GHz+ signals to come off the board and out to instrumentation for functional testing of production units.
A Characterization Engineer needed an alternative to SMP Connectors for device characterization and design correlation - the device being tested is a Cross-Point Switch.
A major defense contractor needed a reliable, high speed (12 Gbps) connector solution that would allow them to easily replace or upgrade expensive Circuit Card Assemblies (CCAs).
A major global telecommunications company was developing their own custom Analog to Digital Converter (ADC) and was looking to replace traditional end launch connector solutions for getting high speed signals off of the PCB during device characterization.
A major defense contractor was developing a high speed transceiver and developed their own, custom IC substrate.
A major IC Manufacturer was developing a new PCIE device and needed a repeatable way to de-embed the signal losses on their compliance base boards (CBB) to allow them to accurately characterize the performance of their device.
Engineers working on a test team at a major IC manufacturer were developing next gen, JESD204B standard data converters, Digital to Analog (DAC) and Analog to Digital (ADC) running at 12GSPS with plans to increase speeds.
