1. Socket Lid
The Socket Lid’s (shown here: Screw Down Lid) primary function is to apply compression force to the customer’s package. Amphenol Ardent Concepts offers many lid styles that satisfy various requirements from bench test (e.g The lid can be outfitted with a heat sink and fan to help with heat dispersion) to flight (e.g integration with flight conduction cooling systems) We are able to customize and partner with third parties on the design of the lid to satisfy program requirements.
2. Socket Head Cap Screws
Attach the socket to the board by threading through the Guide Plate, Interposer, and into the threaded holes of the Stiffener Assembly located on the back side of the PCB.
3. Guide Plate
The Guide Plate· provides alignment of the package to the contacts below, serves as an anchor for the Lid to attach, and provides additional rigidity to the socket assembly.
4. BGA Alignment Sheet (Not Shown)
Typically built out of the same material as [5. Insulator], the BGA alignment sheet is ONLY used for BGA packages and provides proper targeting and alignment to the contacts housed within the interposer below. It is not used for LGA package type.
5. Insulator (Interposer)
The purpose of the interposer is to house our patented contacts that are making the electrical connection between the IC and PCB. Metal or plastic dowels are used for alignment, to match the centers of each component of the socket.
6. PCB Footprint
This represents your board with the socket’s footprint. A PCB footprint drawing is provided with each unique socket design, along with detailed descriptions of tolerances and board fabrication notes such as recommended plating types, via and pad sizes, etc.
7. Board Stiffener
This is to help with the planarity and rigidity of the PCB. Where the board stiffener supports the PCB from the bottom up can be highly customized, in order to make way for capacitor placements. Our mechanical design engineers will take a drawing of the component placement on the bottom layer from you and optimize the stiffener. This “cityscape” support structure design can also be integrated into a larger back plate for the entire PCB if needed.