Join us for a free 30 minute introduction to Ardent Concepts' SK Family of Sockets. This webinar will cover some of the most important benefits of using Ardent Concepts' unique SK Family of test socket solutions when designing and developing next generation electronics.

Who should attend:
Engineers looking to characterize and test high speed RF and digital transmission lines with the industry-leading performance of the Ardent SK Socket series solutions.

Preface:
Engineers involved in the design, testing, and manufacturing of high speed devices are generally focused on sockets that offer high performance at a reasonable cost. Learn how Ardent's patented solderless contact technology, which utilizes industry-leading alloys, makes for a cost-effective and electrically robust socket solution!

Key Benefits:
By attending the webinar you will:

• Learn how our industry-leading, high-performance contact technology delivers superior signal integrity and allows for the rapid testing of multiple integrated circuits using a single socket
• See how easy it is to install, remove, and reuse our sockets across multiple programs thanks to our solderless, compression mount technology
• Learn about how our sockets can save you time and money throughout the design and test process

Join us for a free 30 minute introduction to our TR Multicoax Series where you will learn the key features and benefits of the highest density, high speed, multicoax connector on the market!

Key Takeaways from this Webinar:
• Learn about the benefits of high speed high density connectors that come in a variety of form factors
• Solderless compression mount technology allows these connectors to be reused across multiple programs and boards promoting exponential cost savings
• Superior signal integrity offered through 20 GHz, 40 GHz, and 70 GHz configurations to suit your bandwidth requirements

Join us for a free 30 minute introduction to our CA Series where you will learn the key features and benefits of the highest density, high speed, connectors and interposers on the market!

Key Takeaways from this Webinar:
• Learn about the benefits of high speed high density connectors and the variety of scalable form factors Amphenol Ardent offers
• Solderless compression mount technology allows these connectors to be reused across multiple programs and boards promoting exponential cost savings
• How our CA Series connectors and interposers offer superior signal integrity and high density for applications like high speed backplane, mezzanine, edge card, and optical at a 0.4 mm pitch in a pure vertical interface – no offset required.