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    • micro-LinkOVER™ | Above PCB Connector System | 112Gb/s | PAM4 | 400G |
    • High Speed Multicoax Assemblies
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    • High Speed Multicoax Assemblies High-density, low loss access to multiple high frequency channels. Deployed across high-speed electronics markets including Semiconductor, Communications, Consumer, Supercomputing, and Defense. Excellent signal integrity out to 70 GHz Long term electrical repeatability of connector performance Compression-mount: no solder-down components Small PCB Footprint
      • TR Multicoax Series
        • TR20
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    • Connectors High-density, high speed connectors with superior signal integrity. Range of form factors and rugged capabilities for Computing, Medical, Defense, Communications and Consumer applications. Ardent’s compression mount connectors can drop in and replace expensive pogo pins or unreliable elastomeric contact sets. 1mm Universal Board to Board Chip to Chip Interposers Optical
      • 1mm Universal
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    • Sockets High performing, compression-mount socket solutions for BGA and LGA, QFN/QFP, MEMS and test contactors for other small form factor devices. Don’t see the socket you need? Let us design a custom socket to fit your requirements. Accommodate Wide Range of Package Sizes All-Metal Custom Designs Available
      • 1mm Universal
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US Patent Numbers 6,787,709, 6,909,056, 7,126,062, 7,556,503. Other US and Foreign Patents Pending.
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t: (603) 474-1760
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