Most RecentAmphenol Ardent Concepts Releases High-Density TR90™ Multicoax Connector for Semiconductor, Test & Measurement, Mobile Communication, and Automotive Sector E-Band DesignsJanuary 24, 2023New Product / Press ReleaseAmphenol Ardent Concepts, a leading provider of ganged coaxial connectors for semiconductor, communications, quantum computing, and space and defense applications, is proud to announce the release of TR90, the next generation in its TR Multicoax Series. TR90 is designed to transfer high-speed signals up to 90 GHz, making it the ideal solution for engineers testing or designing systems operating in the E-Band (60 GHz to 90 GHz). TR90 builds upon Amphenol Ardent’s TR Multicoax Series 20/40/70 GHz configurations and is designed for use in 112G/224G, 5G/6G, and automotive radar applications. Unlike competing multicoax assemblies and legacy SMA-style connectors, TR90 utilizes Ardent’s revolutionary solderless compliant contact technology, RC Spring Probe™, to provide designers with a high-performing and mechanically reliable connector that can be securely mated to printed circuit boards with just two screws, ensuring signal fidelity that is at risk with other attachment methods. Compared to traditional solder-down coaxial connectors, TR Multicoax can reduce connector real estate on printed circuit boards by up to 80% and is easily reusable as it can be moved from position to position without the need for any surface mount components. The TR90 Multicoax connector is available in in-line 4 and 8-channel configurations, with the addition of a dual-row 16-channel form factor and right-angle configurations due later in 2023. Signal-to-signal spacing is maintained from existing lower frequency configurations at 2.54mm pitch. Additionally, TR90 is designed to support microstrip, coplanar waveguide, and stripline printed circuit board launches ensuring compatibility with most printed circuit board stackups. TR90 is ideal for designers of optical module, transmission line, switch/routing ASIC, SerDes IP, switch/routing box, datacenter chassis, and AI accelerator products. It offers a newly designed interface and printed circuit board footprint to achieve exceptional signal integrity. “The ability to expand our TR Multicoax Series with a 90 GHz iteration is an exciting achievement by our Research and Design Engineers,” said Stephen Cristaldi, Product Manager of Cable Products at Ardent. “Developing ganged coaxial solutions which can effectively launch 90 GHz signals into a printed circuit board is a challenge felt industry-wide. Achieving 90 GHz repeatably with a completely solderless approach is even more difficult, but guarantees the many benefits our customers expect from our TR Multicoax product family. We continue to develop against our four pillars of design: best in class signal integrity a solderless, compression mount approach to multicoaxial and interposer solutions a focus on signal density mechanical reliability in any environment With a narrow charter to focus on these four pillars, we will continue to support our customer base as they develop products that push the limits of high speed signaling in challenging environments.” For more information about TR90 and other products offered by Amphenol Ardent Concepts, please visit our website, http://www.ardentconcepts.com, or contact our sales team at info@ardentconcepts.com. About Amphenol: Amphenol Corporation is one of the world’s largest designers, manufacturers, and marketers of electrical, electronic and fiber optic connectors and interconnect systems, antennas, sensors and sensor-based products and coaxial and high-speed specialty cable. Amphenol designs, manufactures, and assembles its products at facilities in the Americas, Europe, Asia, Australia, and Africa and sells its products through its own global sales force, independent representatives and a global network of electronics distributors. Amphenol has a diversified presence as a leader in high-growth areas of the interconnect market including: Automotive, Broadband Communications, Commercial Aerospace, Industrial, Information Technology and Data Communications, Military, Mobile Devices and Mobile Networks.... Ardent Concepts, Inc. Releases High-Density Ganged Coaxial Attenuators to Support Scale up of Cryogenic and Quantum Computing ApplicationsFebruary 16, 2022UncategorizedThermalized low noise cryogenic attenuators mate seamlessly with Amphenol Ardent Concepts’ TR Multicoax™ connectors Ardent’s 16 channel Ganged Coaxial Attenuator is 94% more compact than 16 traditional SMA-style attenuators and fits in a 290mm² area compared to nearly 5000mm² for legacy attenuators with torque wrench provisions at the same channel count. Amphenol Ardent Concepts, a leading supplier of ganged coaxial connectors for use in cryogenic environments, has released high-density Ganged Coaxial Attenuators for use in-line with the TR Multicoax™ series to support the many unique challenges of scaling up quantum computing applications for practical use. Density, substantial environmental changes, and an increasing need for more high-speed lanes are causing quantum computer designers to rethink traditional routing methods. By utilizing industry leading materials like Oxygen-free high thermal conductivity (OFHC) copper and NiCr on thermally conductive crystalline quartz dielectric, engineers will be able to drastically decrease real estate required by individual attenuators with minimal change in attenuation with temperature delta down to 3 milliKelvin. Attenuation is offered in 0, 10, and 20 dB configurations and supports bandwidth up to 12 GHz. All configurations offer well controlled insertion loss at 5 GHz of ±1 dB. The initial 16 channel form factor is 94% more compact than 16 traditional SMA-style attenuators and fits in a 290mm² area compared to nearly 5000mm² for legacy attenuators with torque wrench provisions at the same channel count. Ardent plans to introduce additional form factors as needed. The tandem of TR Multicoax connectors and Ganged Coaxial Attenuators provides system developers a total solution from room temperature to Quantum IC. Traditionally, the control and read out lines (IOs) in cryogenic dilution refrigerators are deployed in a massively parallel configuration using traditional coaxial cables as the transmission line media. As quantum computing begins to solidify its technical advantage over classical computing, it does so with the need for higher and higher numbers of qubits. The increase in qubits requires the coaxial cabling solutions to become denser as the hardware designers battle mechanical space requirements and balance the delicate cooling constraints of the cryogenic dilution refrigerators. This presents routing challenges due to the extremely high channel counts and concerns over connector transition failures and many cutting-edge quantum computing developers have turned to Ardent’s TR Multicoax product family to help. “We saw this as an opportunity to help customers working on quantum computing and other cryogenic applications address the inherent challenges of routing signals in such a confined space and at extreme temperature changes. The robustness of our Ganged Coaxial Attenuator combined with its high-density, high-bandwidth, solderless design, made it an ideal solution,” said Stephen Cristaldi, Ardent Product Manager of High-Speed Cable Products. “Pair this Ganged Coaxial Attenuator with TR Multicoax connectors, and system designers can connect hundreds of lines in a matter of minutes with confidence that all lanes will be functional down to milliKelvin temps.” TR Multicoax series connectors, used in quantum computing systems globally, are offered in a variety of channel counts, form factors, and non-magnetic configurations supporting quantum computing and cryogenic applications. “We recognize that practical quantum computing requires hundreds, if not thousands, of qubits. Our TR Multicoax brings that requirement into reality,” said Cristaldi. About Amphenol Ardent Concepts Amphenol Ardent Concepts, Inc. is a division of Amphenol Corporation, one of the world’s largest electrical and optical interconnect suppliers. Amphenol Ardent Concepts is a leading designer and manufacturer of high performance multicoax and twinax assemblies, probes, compliant interfaces, and sockets used in the development of next generation semiconductors and electronics systems. Our core technology is the smallest, fastest, most electrically efficient compression mount all metal connector technology worldwide. It is used to connect integrated circuits and printed circuit boards to instrumentation and to each other offering superior signal integrity in harsh environments. Markets for our products include: Quantum Computing, Semiconductor, Test & Measurement, Military/Aerospace, Communications and Medical. http://www.ardentconcepts.com About Amphenol Amphenol Corporation is one of the world’s largest designers, manufacturers and marketers of electrical, electronic and fiber optic connectors and interconnect systems, antennas, sensors and sensor-based products and coaxial and high-speed specialty cable. Amphenol designs, manufactures and assembles its products at facilities in the Americas, Europe, Asia, Australia and Africa and sells its products through its own global sales force, independent representatives and a global network of electronics distributors. Amphenol has a diversified presence as a leader in high-growth areas of the interconnect market including: Automotive, Broadband Communications, Commercial Aerospace, Industrial, Information Technology and Data Communications, Military, Mobile Devices and Mobile Networks. Ganged Coaxial Connector... Amphenol Ardent Concepts and PHY-SI LLC Released QSFP DD 800G and OSFP 800G Form-Factor Host Compliance Test Fixtures with Access to all Lanes and Targeting IEEE 802.3ck CEI 112G-VSR SpecificationAugust 17, 2021UncategorizedAmphenol Ardent Concepts has released QSFP DD 800G (p/n PHI-SI-QSFP-DD-HCB-A4-32-2) and OSFP 800G (p/n PHI-SI-OSFP-HCB-A4-32-2) Host Compliance Test Fixtures (HCTF) for 800G system and component development in technical collaboration with host/module compliance board manufacturing expert PHY-SI LLC. Utilizing Amphenol Ardent’s patented TR MulticoaxTM interface technology, proven in semiconductor and datacenter component development globally, our QSFP DD 800G and OSFP 800G Host Compliance Test Fixtures allow engineers to develop and characterize systems and devices using these cutting-edge high-speed ports and connectors. Ideal for 800G systems, users can easily characterize all high-speed lines in a simple to use form factor. Sam Kocsis, Director of Standards and Technology, Amphenol ICC said, “The HCTF brings to market a new option for testing 8-lane Medium Dependent Interfaces (MDI), like OSFP and QSFP DD, with a single test fixture. The thoughtful design uses a custom implementation of Ardent’s patented interface while leveraging the deep experience of Amphenol’s copper cable products to create a mechanically robust solution. Each lane is carefully matched through a combination of both coax and PCB structures to ensure that the insertion loss and skew are constant for the entire unit. The consistency of the electrical performance across every single lane of the port really sets this product apart from the alternatives.” The test fixtures are designed to meet IEEE 802.3ck and OIF CEI-112G-VSR test fixture specifications requiring extremely low insertion loss on all 16 differential pairs not practically achievable in PCB structures. As per lane signal speeds and lane counts increased, fabrication of these boards has hit a performance ceiling even with the latest high end printed circuit board materials. “As the race for developers to bring 800G systems to market intensifies, it has become evident that traditional host/module compliance printed circuit boards are struggling to meet the loss specifications laid out by standards organizations. Our ganged TR Multicoax interface and cable solution provided a natural fit to solve the signal integrity road-blocks of these existing legacy products. By mounting directly to PCB without solder in a dense form-factor, we’ve been able to eliminate much of the loss inherent in host compliance boards of pluggable products. Pair that with an extremely dense form factor that lets users access all lanes of a QSFP DD 800G or OSFP 800G, and we knew we had a unique offering,” said Amphenol Ardent Product Manager, Stephen Cristaldi. Ardent’s development of these products came alongside critical input and expertise from industry leader PHY-SI LLC, who Ardent has channel partnered with to bring the HCTFs to market. PHY-SI, for over 18 years, has been dedicated to the development of high-speed communication QSFP28/QSFP56(zQSFP+), SFP28/SFP56(zSFP)+, OSFP56/800, and QSFP-DD56/800 host compliance boards (HCB) and module compliance boards (MCB) for 802.3bj (100GBASE-CR4),802.3by (50GBASE-CR), 802.3cd (50GBASE-CR,100BASE-CR2 and 200GBASE-CR4), 802.3ck (100GBASE-CR1,200BASE-CR2 and 400GBASE-CR4), 802.3bm and 802.3bs. PHY-SI developers are participants and contributors to the IEEE communication standards and understand the complexity of the test compliance fixtures and the accuracy required to meet the standards and specifications. To learn more visit: Amphenol Ardent Concepts – www.ardentconcepts.com/hctf PHY-SI LLC – www.phy-si.com Part Numbers: QSFP DD (PHI-SI-QSFP DD-HCB-A4-32-2) OSFP (PHI-SI-OSFP-HCB-A4-32-2): About Amphenol Ardent Concepts Amphenol Ardent Concepts, Inc. is a division of Amphenol Corporation, one of the world’s largest designers, manufacturers and marketers of electrical, electronic and fiber optic connectors and interconnect systems, antennas, sensors and sensor-based products and coaxial and high-speed specialty cable. Amphenol Ardent Concepts is a leading designer and manufacturer of high performance multicoax and twinax assemblies, probes, connectors, and sockets used in the development of next generation semiconductors and electronics systems. Our core technology is the smallest, fastest, most electrically efficient compression mount connector technology worldwide. It is used to connect integrated circuits and printed circuit boards to instrumentation and to each other offering superior signal integrity in a high speed environment. Markets for our products include: Semiconductor, Test & Measurement, Military/Aerospace, Communications and Medical. http://www.ardentconcepts.com. About PHY-SI LLC PHY-SI produces high speed test fixtures for generations of small form-factor pluggables and the team has over 30 years of experience in the telecommunication industry playing an active role in the development of a number of telecommunication industry standards such as IEEE 802.3, IEEE 802.24 and TIA-TR42. PHY-SI’s founder Chris Diminico is a member of IEEE 802.3ck editorial team, task group chair 802.24.2 IoT Task Group, task group chair TIA/TR42.7 single pair Ethernet field testing, and IEEE 802.3 liaison to TIA-TR42.... Amphenol Ardent Concepts Releases micro-LinkOVER™ as a Featured Near-Chip/On-Package Termination in Amphenol’s OverPass™ Series of PCB Trace Bypass ConnectorsNovember 12, 2020New Product / Press Releasemicro-LinkOVER Showcases Ardent’s Ability to Provide a High-Density Compression OEM Interconnect Delivering Signaling Speeds to 112Gb/s PAM4 per Lane and Beyond HAMPTON, N.H. (PRWEB) NOVEMBER 12, 2020 Amphenol Ardent Concepts has launched its newest line of solderless compression mount connectors, the micro-LinkOVER™ (P/N: mLO-XXXXX) Series, to the marketplace. micro-LinkOVER is an OverPass™ twinaxial connector system that provides system designers and layout engineers a cost-effective approach to unlock the design flexibility needed to manage the technical challenges of 56G and 112G systems and beyond. micro-LinkOVER supports 10Gb/s, 28Gb/s, 56Gb/s, and 112Gb/s PAM4 per lane signaling speeds with high signal-to-noise ratio and low VSWR. micro-LinkOVER’s direct-to-PCB compression mount solution eliminates the need for any lossy paddle cards, minimizing transitions and losses on system budgets. micro-LinkOVER’s modular design allows for multiple form factors in dense footprints to fit in crowded real estate environments. “We leveraged our experience designing and building reliable signal integrity connectors with compression mount technology in the near chip connector world to provide a connector capable of supporting current and upcoming 56G and 112G designs and beyond as customers think ahead towards 224G,” said Gordon Vinther, Ardent’s Managing Director. Designs of micro-LinkOVER are available for both chip perimeter and direct-to-substrate applications. micro-LinkOVER is an ideal solution for 100G/200G/400G Systems, lnfiniband™, PCle®, Chip-to-Chip links, and 5G systems. Furthermore, a low profile (4.2mm mated height) gives designers the added flexibility needed to escape under heat sinks and from the bottom side of PCBs to minimize trace loss by getting closer to devices. micro-LinkOVER is designed to be paired with Amphenol’s extensive line of external interfaces and cabled backplane interfaces. “As our customers drive towards 112G PAM4 and beyond, micro-LinkOVER is an ideal near-chip/on-package connector for internal cabled hosts, or paired with our latest generation OSFP and QSFP DD connectors, to solve the most complex electrical and mechanical packaging issues. Through its innovative direct cable to host termination, micro-LinkOVER is packaged in an extremely low mechanical profile allowing placement under heatsinks and as close to ASICs as possible. The optimized signal path delivers best in class signal integrity with excellent return loss performance,” said Brian Kirk, Director of Engineering, for Amphenol High Speed IO. Customers interested in micro-LinkOVER can visit Ardent’s website for product specifications, data and availability. Additional information on Amphenol OverPass is available on the OverPass website. About Amphenol Ardent Concepts Amphenol Ardent Concepts, Inc. is a division of Amphenol Corporation, one of the world’s largest designers, manufacturers and marketers of electrical, electronic and fiber optic connectors and interconnect systems, antennas, sensors and sensor-based products and coaxial and high-speed specialty cable. Amphenol Ardent Concepts is a leading designer and manufacturer of high performance multicoax and twinax assemblies, probes, connectors, and sockets used in the development of next generation semiconductors and electronics systems. Our core technology is the smallest, fastest, most electrically efficient compression mount connector technology worldwide. It is used to connect integrated circuits and printed circuit boards to instrumentation and to each other offering superior signal integrity in a high speed environment. Markets for our products include: Semiconductor, Test & Measurement, Military/Aerospace, Communications and Medical. ContactsArdent ConceptsNat Stevens, 603-474-1760nstevens@ardentconcepts.com... BAE Systems Awards Amphenol Ardent Concepts 2020 Gold Tier Supplier AwardMay 21, 2020UncategorizedHAMPTON, N.H. MAY 21, 2020 Amphenol Ardent Concepts is proud to announce receiving a Gold Tier Supplier status with BAE Systems. This coveted honor, part of BAE Systems’ Partner 2 Win program, recognizes suppliers who have achieved operational excellence and eliminated defects in its supply chain by raising the bar of performance expectations to meet the demand of current and future customers. “We are honored to have received this award,” says Manager Gordon Vinther, “Our team has worked very hard to ensure all product leaving our factory is met with stringent quality control. BAE’s recognition is a testament to the operational readiness of Amphenol Ardent to support the world’s most challenging connector applications.” About Amphenol Ardent Concepts Amphenol Ardent Concepts is a leading designer and manufacturer of high performance multicoax and coaxial assemblies, connectors, and sockets used in the development of next generation semiconductors and electronics systems. Our core technology is the smallest, fastest, most electrically efficient compression mount connector technology worldwide. As data rate requirements increase and devices and systems shrink, Amphenol Ardent’s products deliver superior signal integrity in a dense footprint that can be reusable across programs to maximize cost savings.... Amphenol Ardent Concepts Releases New Low-Profile Right Angle 16-Channel Multicoax ConnectorJanuary 28, 2020Press Release / TR16-Channel Form-Factor Allows System Designers to Escape Signals up to 70 GHz from Existing Standard Footprint Symbol Amphenol Ardent Concepts has released a new form factor of its TR Multicoax connector. This new 16-channel right angle variant is designed specifically to alleviate height concerns of our vertical launch connectors in applications that are Z-height limited, including taking signals from underneath the board, escaping signals under a heat sink, or getting cables out under a thermal shroud. This new form factor utilizes the standard 16-channel footprint that Ardent’s Straight Mount TR Multicoax is designed for, allowing designers to exchange launch form factors without any layout change. “Designers today are facing the increasing challenge of laying out more complex printed circuit boards with added dimensional constraints,” said Nat Stevens, Amphenol Ardent’s Director of Marketing. “By expanding our already wide offering of form-factors, channel counts, and frequency options for our TR Multicoax products, while standardizing on a few footprint symbols, engineers have significantly more project flexibility.” The dense PCB footprint of the TR Multicoax saves crucial real estate and gets the coaxial cables extremely close to devices, minimizing lossy trace lengths. The interface is compression-mount which avoids waste of costly solder-down components that can’t be recovered, and encourages reuse across programs. TR Multicoax series connectors are offered in a variety of channel counts and form factors and can support speeds of 70 GHz+ with a roadmap to 110 GHz in the near future. For more information, please contact Amphenol Ardent at info@ardentconcepts.com About Amphenol Ardent Concepts Ardent Concepts, Inc., was acquired by Amphenol ICC (AICC), a division of Amphenol Corporation, and a world leading provider of interconnect solutions for the Information, Communications and Commercial electronics markets in June of 2018. Amphenol Ardent Concepts (AAC) is a leading designer and manufacturer of high performance multicoax assemblies, probes, connectors, and sockets used in the development of next generation semiconductors and electronics systems. Our core technology is the smallest, fastest, most electrically efficient compression mount connector technology worldwide. It is used to connect integrated circuits and printed circuit boards to instrumentation and to each other offering superior signal integrity in a high speed environment. Markets for our products include: Semiconductor, Test & Measurement, Military/Aerospace, Communications and Medical. https://www.ardentconcepts.com. ContactAmphenol Ardent ConceptsNat Stevens, 603-474-1760nstevens@ardentconcepts.com View and download the connector drawing in the link below: TR70-RA-16X2-2.54-XXXX-1Download... MultiLane Chooses Amphenol Ardent Concepts for 400G Module Compliance BoardsSeptember 24, 2019Press Release / TRMultiLane and Amphenol Ardent Concepts are teaming up to provide 400G QSFP-DD and OSFP low-cost, consumable MCBs for manufacturing testing. MultiLane’s module compliance boards are fully featured, CMIS compliant and low-loss, making them ideal for optical transceiver testing. These boards are now paired with Amphenol Ardent Concepts’ replaceable, multi-channel TR Multicoax Series connectors, resulting in an extremely low-cost, consumable MCB for high volume testing. The key features of this combination include programming and testing of 400G QSFP-DD/OSFP transceivers and active optical cables. Additionally, it boasts a user-friendly GUI supporting all features defined by QSFP-DD/OSFP MSA. MultiLane’s board is ideal for transceiver manufacturing testing, optical transmitter testing, receiver sensitivity, electrical interface testing, and thermal testing of transceivers. MultiLane’s ML4062-TR (QSFP-DD MCB) and ML4064-TR (OSFP MCB) can also be used in conjunction with ML4066 analyzer boards to enable low speed I2C CMIS testing, in addition to abovementioned capabilities. Two TR Multicoax Series connectors are needed for each compliance board. This connector delivers superior signal integrity from multiple high-speed analog or digital channels. With a choice of 20 GHz, 40 GHz, or 70 GHz configurations, users can upgrade their connectors as bandwidth requirements on their applications increase. TR utilizes Amphenol Ardent Concepts’ patented solderless technology, encouraging cost savings and reusability across multiple programs. The combination of these two innovative products has given the manufacturing test market one of the most compelling MCBs on the market. Low-cost, reusability, high density, and excellent signal integrity are incredibly beneficial to test and measurement, and this board provides all of them. MultiLane will be running a live demonstration of this module compliance board at the European Conference on Optical Communication in Dublin September 23-25 at Booth #481. Amphenol Ardent Concepts is a leading designer and manufacturer of high performance multicoax and coaxial assemblies, connectors, and sockets used in the development of next generation semiconductors and electronics systems. Our core technology is one of the smallest, fastest, most electrically efficient compression mount connector technologies commercially available. As data rate requirements increase and devices and systems shrink, Amphenol Ardent’s products deliver superior signal integrity in a dense footprint that can be reusable across programs to maximize cost savings. MultiLane, a leading provider of T&M equipment for production testing, develops instruments and interconnects for 10 to 400 Gb/s data rates. Products include BERTs, TDR, optical and electrical oscilloscopes, optical switch boxes, and a host of MSA-compliant development tools for QSFP28, QSFP-DD, OSFP, and other standards. The company also offers compliance test services and fully automated test solutions. In addition, MultiLane develops high speed ATE modules that fit in wafer-scale automated test systems such as Advantest’s V93K platform. MultiLane’s products are used to test semiconductors, DACs, transceivers, and system blades. More information can be found at https://www.multilaneinc.com.... Amphenol Ardent Concepts Acquires New Manufacturers’ Representative, NWN, Inc.August 7, 2019Press ReleaseIt is our pleasure to introduce our newest manufacturers’ representative to the Silicon Valley area: NWN, Inc. We are very excited to welcome our new reps into the Amphenol Ardent family. Founded in Northern California in 1994, NWN handles the territories of Northern California and Northern Nevada. NWN specializes in the sales of RF, Microwave, Frequency Control, and Analog Components. Their target markets include Mil/Aero, test & measurement, semiconductor tool, networking, and microwave component companies located around their territory. Amphenol Ardent Concepts is a leading designer and manufacturer of high performance multicoax and coaxial assemblies, connectors, and sockets used in the development of next generation semiconductors and electronics systems. Our core technology is the smallest, fastest, most electrically efficient compression mount connector technology worldwide. As data rate requirements increase and devices and systems shrink, Ardent’s products deliver superior signal integrity in a dense footprint that can be reusable across programs to maximize cost savings. Customers already look to both NWN and Ardent for similar niche solutions to their signal integrity challenges. “It seems that our markets are very synergistic for both companies, and such a logical fit to collaborate together,” said NWN Principal Owner, Bob Gibbens. We look forward to working together as we strive to solve your application needs.... Press Release: Amphenol Ardent Concepts Releases Innovative Multicoax Connector to Eliminate Serpentine Trace Routing when Characterizing OIF Compliant IC-TROSA PackagesOctober 8, 2018Press Release / TRAmphenol Ardent Concepts has released a new form factor of its TR Multicoax connector. The new connector was designed specifically for solving signal integrity issues caused by serpentine trace routing from high speed devices. TR Equal Trace delivers superior signal integrity from multiple high-speed channels in an arched footprint, making it ideal for applications where equal and short trace lengths are imperative for performance tuning. In these cases, TR Equal Trace can eliminate the need to create complicated serpentine traces, helping to ensure signals reach their destination at the same time in data and clock routing for peak performance. The tight pitch of TR Equal Trace gets the connector closer to the device to reduce signal loss. “Higher frequencies, data center and networking interoperability, and increasing board and component complexity and costs are driving a need for greater integration of transmit and receive optical components,” said Nat Stevens, Amphenol Ardent’s Director of Marketing. “Furthermore, small form-factor pluggable compliance and hosts boards are being manufactured in high volume for compliance testing. We recognized this as an opportunity to simplify or solve the challenges of characterizing these devices by offering a product with exceptional signal integrity, high density, and repeatability, in a novel new form factor.” Ardent’s patent pending form factor of TR Equal Trace was designed to be used alongside the Optical Internetworking Forum (OIF) Type-1 IC-TROSA (Integrated Coherent Transmitter-Receiver Optical Subassembly). The Type-1 IC-TROSA project aims to help to reduce optical module size and to drive an industry consensus across leading optical component developers. The arched footprint of TR Equal Trace allows the traces coming off the back side of the IC-TROSA to be exactly the same length and extremely short to best showcase the performance of these devices. Similarly, users can avoid the traditional layout of multiple surface mount connectors and simplify trace matching on a host or module compliance board with just a TR Equal Trace and a footprint symbol on the PCB. TR Multicoax series connectors are offered in a variety of channel counts and form factors, such as right angle cable escape, and can support speeds of 70 GHz+ with a roadmap to 110 GHz in the near future. About Amphenol Ardent Concepts Ardent Concepts, Inc., was acquired by Amphenol ICC (AICC), a division of Amphenol, and a world leading provider of interconnect solutions for the Information, Communications and Commercial electronics markets in June of 2018. Amphenol Ardent Concepts (AAC) is a leading designer and manufacturer of high performance multicoax assemblies, probes, connectors, and sockets used in the development of next generation semiconductors and electronics systems. Our core technology is the smallest, fastest, most electrically efficient compression mount connector technology worldwide. It is used to connect integrated circuits and printed circuit boards to instrumentation and to each other offering superior signal integrity in a high speed environment. Markets for our products include: Semiconductor, Test & Measurement, Military/Aerospace, Communications and Medical. https://ardentstage1.wpengine.com.... Ardent Concepts has Been Acquired by AmphenolJune 22, 2018Press ReleaseDear Valued Customers, I am excited to announce Ardent Concepts, Inc. has been acquired by Amphenol ICC (AICC), a division of Amphenol, and a world leading provider of interconnect solutions for the Information, Communications and Commercial electronics markets. This investment by Amphenol ICC will allow Ardent, now Amphenol Ardent Concepts (AAC), to utilize AICC’s global reach and resources, accelerate the adoption of Ardent’s industry-leading products worldwide, and provide a strong foundation for continually developing the most electrically efficient connectors for our core markets. Amphenol Ardent Concepts will continue to be led by its existing management team and will be aligned under Amphenol ICC’s Mezzanine Products Business. The same familiar and dedicated faces that you’ve worked with in the past will continue to support your application needs. This is an exciting time for Amphenol Ardent Concepts, as 2018 marks our 15th anniversary. Our growth over this time has been exciting and tremendous and I look forward utilizing Amphenol ICC’s investment to take our company to the next level. Sincerely, Gordon A. Vinther General Manager Amphenol Ardent Concepts...