Technology
Ardent Concepts delivers high performance test sockets and connectors using patented technology designed to optimize electrical performance, reduce space constraints on the board, and lower overall costs. Read more about each patented technology below:
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Cost-Effective High Performance Stamped Contact for Area Array Applications Down to .6mm Pitch
 CR ™ |
Scalable Solutions for LGA, BGA Test Sockets and Board Connectors Down to .4mm Pitch
 SP™ |
High Reliability for Chipscale ATE Test and Flex-to-Board Applications Down to .4mm Pitch
 SC™ |
Ardent Concepts delivers high performance test sockets and connectors using patented technology designed to optimize electrical performance, reduce space constraints on the board, and lower overall costs.
All of our solutions have been extensively tested for high-reliability and exceptional signal integrity. We use industry standard insulating materials for housing and cutting edge engineering designs to allow our customers to achieve greater levels of electrical interconnect without sacrificing mechanical performance.
Whether your need is for a low volume bench test BGA Test Socket, high volume custom compression mount connector, or a high throughput ATE Test Contactor system, Ardent has a contact technology to meet your needs.
If you need immediate assistance on a design or would just like to learn more about the best-in-class connector designs from Ardent, please contact us today and we will provide you with information, datasheets and test reports.
