How We Solve Your Interconnect Signal Integrity Challenges
Ardent Concepts is a leading designer and manufacturer of high performance multicoax and coaxial assemblies, connectors, and sockets used in the development of next generation semiconductors and electronics systems. Our core technology is the smallest, fastest, most electrically efficient compression mount connector technology worldwide. As data rate requirements increase and devices and systems shrink, Ardent’s products deliver superior signal integrity in a dense footprint that can be reusable across programs to maximize cost savings.
Our focus is on helping bring next generation computing to market through novel connector designs for test & measurement, OEM applications, and specialized military applications. Ardent’s patented contact technologies are well suited for advanced multi-GHz applications such as board stack connectors, coaxial connectors, fPGA sockets, flex circuit connectors, probe interfaces, and mezzanine card connectors. We have a complete line of high performance test socket solutions for the most advanced chipsets such as RF devices, ASICS, switches, processors and MEMS devices. We support chip to chip, chip to board, board to board and flex to board applications.