Learn about our Commitment to Signal Integrity
High Speed Cable Assemblies
TR™ Multicoax delivers superior signal integrity from multiple high speed analog or digital channels up to 90 GHz+
Multi-GHz Connectors
Scalable, custom connectors available in a variety of form factors for next generation electronics systems
High Performance Sockets
Durable 40 GHz+ socket solutions offer low loss connection in a dense form factor for high performing devices
The newest form factors of Ardent’s TR Multicoax connectors support the many unique challenges of Quantum Computing applications.
The Benefits of TR Multicoax
Signal Integrity:
Ardent’s interconnect technology was born of a simple concept; What if we could eliminate the barrel and the plunger from a traditional “pogo” style spring pin and make the spring inside behave like an electrical contact instead of behaving like an inductor at multi-GHz speeds?
Solderless
Our products are all based on solderless compression mount technology enabling more reliable and electrically repeatable performance over time and across programs. Our solderless compression products allow our customers to be agile in changing their designs without having to scrap entire projects and printed circuit boards with components soldered to the board. This leads to enhanced flexibility and cost savings.
Density
Contacts can be arranged in pitches down to 0.4mm (grid array) and 2.54mm signal-to-signal (coaxial array) to scale up the number of lanes in any system.
Mechanical Reliability
Mil-Spec qualified and rated for thousands of cycles in the harshest environments, Ardent’s patented technologies are production proven with over 20 years of field use for test and measurement and OEM interconnect.
Upcoming Events
Recent News
Ohio State, Amphenol Ardent Team up to Advance Quantum Computing
As featured by The Ohio State University: December 10, 2025 A new partnership between The Ohio State University and Amphenol Ardent Concepts is helping accelerate the development of next-generation quantum
Ardent Concepts Presents at DesignCon 2025: Maximizing Value with Multi-Purpose Test Vehicles for High-Frequency Testing
Join us in the Chiphead Theater on Thursday, January 30, from 2:15 PM to 3:00 PM Our session will highlight innovative solutions that drive efficiency, flexibility, and performance in high-frequency
Amphenol Ardent Concepts Ends 2024 as a Gold Tier Supplier Through BAE Systems’ Partner 2 Win Program, Reinforcing Commitment to Excellence and Quality
Hampton, NH – January 8, 2025 Amphenol Ardent Concepts, a leader in high-performance interconnect solutions, is proud to announce its recognition as a Gold Tier Supplier by BAE Systems through